about heat sink

• MartyG

  • August 20, 2024 09:55

  Hi Jooha Maeng  If you are thinking of using a RealSense depth module board instead of a cased camera then the two circuit boards inside the D405 are available as the D401 depth module and the Vision Processor D4 V4 board.

   

  

   

  Page 116 of the current edition of the data sheet document for the 400 Series cameras provides guidance about choosing and installing a heatsink.

  https://dev.intelrealsense.com/docs/intel-realsense-d400-series-product-family-datasheet

   

  Although the D401 module is shorter in width than other depth modules such as D430 and D450, you should be able to purchase a heatsink that is small enough to attach to the back of the D401 module with a layer of thermal paste between the module and the sink.  Googling for the term small heatsink will provide some examples of such products.

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• Jooha Maeng

  • August 23, 2024 06:17

  MartyG
  
  Thank you for your kindly reply.

   You are saying to disassemble the D405 and glue a heat sink to it, right?

  If yes, could you give me a guide on how to disassemble it?

   

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• MartyG

  • August 23, 2024 08:32

  I suggested to attach a heatsink to the back of a D401 module.  If your preference is to attach a heatsink to the back of the D401 module inside a D405 that you already have then the limited space in the D405's casing may make it difficult to find a heatsink product that will fit.

   

  Regarding opening the casing, it appears as though there is a tiny screw at the bottom of each of the two holes on the back of the camera.  Such screws would require a special screwdriver that can handle screws of that size.

   

  Beyond getting the casing open, there is not any guidance available about disassembly of a D405 unfortunately

   

  There are heatsink products for smartphones that only require the heatsink to be attached to the back of the phone without having to disassemble it.  You may be able to do something similar with the D405's casing without having to open it up.

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